surface mount rf schottky barrier diodes technical data hsms-281x series features surface mount packages low flicker noise low fit (failure in time) rate* six-sigma quality level single, dual and quad versions tape and reel options available lead-free option available * for more information see the surface mount schottky reliability data sheet. description/applications these schottky diodes are specifically designed for both analog and digital applications. this series offers a wide range of specifications and package configurations to give the designer wide flexibility. the hsms-281x series of diodes features very low flicker (1/f) noise. note that agilents manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match. package lead code identification, sot-23/sot-143 (top view) common cathode #4 unconnected pair #5 common anode #3 series #2 single #0 12 3 12 34 ring quad #7 12 34 bridge quad #8 12 34 12 3 12 3 12 3 package lead code identification, sot-323 (top view) package lead code identification, sot-363 (top view) common cathode f common anode e series c single b unconnected trio l 123 654 high isolation unconnected pair k 123 654 notes: 1. package marking provides orientation and identification. 2. see electrical specifications for appropriate package marking. pin connections and package marking gux 1 2 3 6 5 4
2 electrical specifications t c = 25 c, single diode [4] maximum maximum minimum maximum forward reverse typical part package breakdown forward voltage leakage maximum dynamic number marking lead voltage voltage v f (v) @ i r (na) @ capacitance resistance hsms [5] code code configuration v br (v) v f (mv) i f (ma) v r (v) c t (pf) r d ( ? ? ? ? ? ) [6] 2810 b0 [3] 0 single 20 400 1.0 35 200 15 1.2 15 2812 b2 [3] 2 series 2813 b3 [3] 3 common anode 2814 b4 [3] 4 common cathode 2815 b5 [3] 5 unconnected pair 2817 b7 [3] 7 ring quad [5] 2818 b8 [3] 8 bridge quad [5] 281b b0 [7] b single 281c b2 [7] c series 281e b3 [7] e common anode 281f b4 [7] f common cathode 281k bk [7] k high isolation unconnected pair 281l bl [7] l unconnected trio test conditions i r = 10 ai f = 1 ma v f = 0 v i f = 5 ma f = 1 mhz notes: 1. ? v f for diodes in pairs and quads in 15 mv maximum at 1 ma. 2. ? c to for diodes in pairs and quads is 0.2 pf maximum. 3. package marking code is in white. 4. effective carrier lifetime ( ) for all these diodes is 100 ps maximum measured with krakauer method at 5 ma. 5. see section titled quad capacitance. 6. r d = r s + 5.2 ? at 25 c and i f = 5 ma. 7. package marking code is laser marked. absolute maximum ratings [1] t c = 25 c symbol parameter unit sot-23/sot-143 sot-323/sot-363 i f forward current (1 s pulse) amp 1 1 p iv peak inverse voltage v same as v br same as v br t j junction temperature c 150 150 t stg storage temperature c -65 to 150 -65 to 150 jc thermal resistance [2] c/w 500 150 notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. t c = +25 c, where t c is defined to be the temperature at the package pins where contact is made to the circuit board. esd warning: handling precautions should be taken to avoid static discharge.
3 quad capacitance capacitance of schottky diode quads is measured using an hp4271 lcr meter. this instrument effectively isolates individual diode branches from the others, allowing accurate capacitance measurement of each branch or each diode. the conditions are: 20 mv r.m.s. voltage at 1 mhz. agilent defines this measurement as cm , and it is equivalent to the capacitance of the diode by itself. the equivalent diagonal and adjacent capacitances can then be calculated by the formulas given below. in a quad, the diagonal capaci- tance is the capacitance between points a and b as shown in the figure below. the diagonal capacitance is calculated using the following formula c 1 x c 2 c 3 x c 4 c diagonal = _______ + _______ c 1 + c 2 c 3 + c 4 c 1 c 2 c 4 c 3 a b c the equivalent adjacent capacitance is the capacitance between points a and c in the figure below. this capacitance is calculated using the following formula 1 c adjacent = c 1 + ____________ 1 1 1 CC + CC + CC c 2 c 3 c 4 spice parameters parameter units hsms-281x b v v25 c j0 pf 1.1 e g ev 0.69 i bv ae-5 i s a 4.8e - 9 n 1.08 r s ? 10 p b v 0.65 p t 2 m 0.5 c j r j r s r j = 8.33 x 10 -5 nt i b + i s where i b = externally applied bias current in amps i s = saturation current (see table of spice parameters) t = temperature, k n = ideality factor (see table of spice parameters) note: to effectively model the packaged hsms-281x product, please refer to application note an1124. r s = series resistance (see table of spice parameters) c j = junction capacitance (see table of spice parameters) linear equivalent circuit, diode chip
4 typical performance, t c = 25 c (unless otherwise noted), single diode figure 1. forward current vs. forward voltage at temperatures. 0 0.1 0.3 0.2 0.5 0.6 0.4 0.8 0.7 i f ?forward current (ma) v f ?forward voltage (v) 0.01 10 1 0.1 100 t a = +125 c t a = +75 c t a = +25 c t a = ?5 c figure 2. reverse current vs. reverse voltage at temperatures. 05 15 i r ?reverse current (na) v r ?reverse voltage (v) 10 1 1000 100 10 100,000 10,000 t a = +125 c t a = +75 c t a = +25 c figure 3. dynamic resistance vs. forward current. 0.1 1 100 r d ?dynamic resistance ( ? ) i f ?forward current (ma) 10 1 10 1000 100 figure 4. total capacitance vs. reverse voltage. 02 6 41012 816 14 c t ?capacitance (pf) v r ?reverse voltage (v) 0 0.75 0.50 0.25 1.25 1 v f - forward voltage (v) figure 5. typical v f match, pairs and quads. 30 10 1 0.3 30 10 1 0.3 i f - forward current (ma) ? v f - forward voltage difference (mv) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 i f (left scale) ? v f (right scale)
5 table 1. typical spice parameters. parameter units hsms-280x hsms-281x hsms-282x b v v75 25 15 c j0 pf 1.6 1.1 0.7 e g ev 0.69 0.69 0.69 i bv a 1 e-5 1 e-5 1 e-4 i s a 3 e-8 4.8 e-9 2.2 e-8 n 1.08 1.08 1.08 r s ? 30 10 6.0 p b (v j ) v 0.65 0.65 0.65 p t (xti) 2 2 2 m 0.5 0.5 0.5 applications information introduction product selection agilent s family of schottky products provides unique solu- tions to many design problems. the first step in choosing the right product is to select the diode type. all of the products in the hsms-282x family use the same diode chip, and the same is true of the hsms-281x and hsms-280x families. each family has a different set of characteristics which can be compared most easily by consulting the spice parameters in table 1. a review of these data shows that the hsms-280x family has the highest breakdown voltage, but at the expense of a high value of series resistance (r s ). in applica- tions which do not require high voltage the hsms-282x family, with a lower value of series resistance, will offer higher current carrying capacity and better performance. the hsms- 281x family is a hybrid schottky (as is the hsms-280x), offering lower 1/f or flicker noise than the hsms-282x family. in general, the hsms-282x family should be the designer s first choice, with the -280x family reserved for high voltage applica- tions and the hsms-281x family for low flicker noise applications. assembly instructions sot-323 pcb footprint a recommended pcb pad layout for the miniature sot-323 (sc-70) package is shown in figure 6 (dimensions are in inches). this layout provides ample allowance for package placement by auto- mated assembly equipment without adding parasitics that could impair the performance. 0.026 0.035 0.07 0.016 figure 6. pcb pad layout (dimensions in inches). assembly instructions sot-363 pcb footprint a recommended pcb pad layout for the miniature sot-363 (sc-70, 6 lead) package is shown in figure 7 (dimensions are in inches). this layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.026 0.075 0.016 0.035 figure 7. pcb pad layout (dimensions in inches).
6 time (seconds) t max temperature ( c) 0 0 50 100 150 200 250 60 preheat zone cool down zone reflow zone 120 180 240 300 figure 8. surface mount assembly profile. smt assembly reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., ir or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. components with a low mass, such as the sot package, will reach solder reflow temperatures faster than those with a greater mass. agilent s sot diodes have been qualified to the time-temperature profile shown in figure 8. this profile is representative of an ir reflow type of surface mount assembly process. these parameters are typical for a surface mount assembly process for agilent diodes. as a general guideline, the circuit board and components should be exposed only to the minimum tempera- tures and times necessary to achieve a uniform reflow of solder. after ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. the preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporat- ing solvents from the solder paste. the reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. the rates of change of tempera- ture for the ramp-up and cool- down zones are chosen to be low enough to not cause deformation of the board or damage to compo- nents due to thermal shock. the maximum temperature in the reflow zone (t max ) should not exceed 235 c.
7 part number ordering information no. of part number devices container hsms-281x-tr2* 10000 13" reel hsms-281x-tr1* 3000 7" reel hsms-281x-blk * 100 antistatic bag x = 0, 2, 3, 4, 5, 7, 8, b, c, e, f, k, l for lead-free option, the part number will have the character "g" at the end, eg. hsms-281x-tr2g for a 10,000 lead-free reel. package dimensions outline 23 (sot-23) outline 143 (sot-143) 3 1 2 side view top view end view dimensions are in millimeters ( inches ) 1.02 (0.040) 0.89 (0.035) 0.60 (0.024) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083) 3.06 (0.120) 2.80 (0.110) 2.04 (0.080) 1.78 (0.070) 1.02 (0.041) 0.85 (0.033) 0.152 (0.006) 0.066 (0.003) 0.10 (0.004) 0.013 (0.0005) 0.69 (0.027) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) x x x package marking code (xx) date code (x) 0.69 (0.027) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083) 0.60 (0.024) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) 0.10 (0.004) 0.013 (0.0005) 1.04 (0.041) 0.85 (0.033) 0.92 (0.036) 0.78 (0.031) 2.04 (0.080) 1.78 (0.070) dimensions are in millimeters (inches) 0.15 (0.006) 0.09 (0.003) 3.06 (0.120) 2.80 (0.110) package marking code (xx) 43 1 2 x x x date code (x) outline sot-363 (sc-70 6 lead) outline sot-323 (sc-70 3 lead) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) ref. 0.650 bsc (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 ref. 10 0.425 (0.017) typ. dimensions are in millimeters ( inches ) package marking code (xx) x x x date code (x) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) ref. 0.650 bsc (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 ref. 10 0.425 (0.017) typ. dimensions are in millimeters ( inches ) package marking code (xx) x x x date code (x)
8 device orientation user feed direction cover tape carrier tape reel for outline sot-143 note: "ab" represents package marking code. "c" re p resents date code. end vie w 8 mm 4 mm top view abc abc abc abc for outlines sot-23, -323 note: "ab" represents package marking code. "c" represents date code. end vie w 8 mm 4 mm top view abc abc abc abc end vie w 8 mm 4 mm top view note: "ab" represents package marking code. "c" represents date code. abc abc abc abc for outline sot-363
9 tape dimensions and product orientation for outline sot-23 9 max a 0 p p 0 d p 2 e f w d 1 ko 8 max b 0 13.5 max t1 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 3.15 0.10 2.77 0.10 1.22 0.10 4.00 0.10 1.00 + 0.05 0.124 0.004 0.109 0.004 0.048 0.004 0.157 0.004 0.039 0.002 cavity diameter pitch position d p 0 e 1.50 + 0.10 4.00 0.10 1.75 0.10 0.059 + 0.004 0.157 0.004 0.069 0.004 perforation width thickness w t1 8.00 + 0.30 ? 0.10 0.229 0.013 0.315 + 0.012 ? 0.004 0.009 0.0005 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance between centerline for outline sot-143 w f e p 2 p 0 d p d 1 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 3.19 0.10 2.80 0.10 1.31 0.10 4.00 0.10 1.00 + 0.25 0.126 0.004 0.110 0.004 0.052 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.50 + 0.10 4.00 0.10 1.75 0.10 0.059 + 0.004 0.157 0.004 0.069 0.004 perforation width thickness w t1 8.00 + 0.30 ? 0.10 0.254 0.013 0.315+ 0.012 ? 0.004 0.0100 0.0005 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance a 0 9 max 9 max t 1 b 0 k 0
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (65) 6756 2394 india, australia, new zealand: (65) 6755 1939 japan: (+81 3) 3335-8152(domestic/international), or 0120-61-1280(domestic only) korea: (65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (65) 6755 2044 taiwan: (65) 6755 1843 data subject to change. copyright ? 2004 agilent technologies, inc. obsoletes 5968-7649e ma rch 2 4 , 2004 5989-0475en tape dimensions and product orientation for outlines sot-323, -363 p p 0 p 2 f w c d 1 d e a 0 an t 1 (carrier tape thickness) t t (cover tape thickness) an b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.40 0.10 2.40 0.10 1.20 0.10 4.00 0.10 1.00 + 0.25 0.094 0.004 0.094 0.004 0.047 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.55 0.05 4.00 0.10 1.75 0.10 0.061 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 0.30 0.254 0.02 0.315 0.012 0.0100 0.0008 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance for sot-323 (sc70-3 lead) an 8 c max for sot-363 (sc70-6 lead) 10 c max angle width tape thickness c t t 5.4 0.10 0.062 0.001 0.205 0.004 0.0025 0.00004 cover tape
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